tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 1 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? applications sot - 89 package ? repeaters ? mobile infrastructure ? lte / wcdma / cdma / edge ? general p urpose wireless product features functional block diagram ? 1 0 0 - 4000 mhz ? 13 db gain @ 1 .9 g hz ? 1. 3 db noise figure @ 1 . 9 g hz ? + 4 1 dbm output ip3 ? +23. 6 dbm p1db ? 50 ohm ca scadable gain block ? unconditionally stable ? high input power capability ? +5v single supply, 12 5 ma current ? sot - 89 package general description pin configuration the tqp3m 9007 is a high linearity low noise gain block amplifier in a low - cost surfac e - mount package. at 1.9 ghz, the amplifier typically provides 1 3 db gain, + 4 1 dbm oip3, and 1. 3 db noise figure while drawing 1 25 ma current. the device is housed in a leadfree/green/rohs - compliant industry - standard sot - 89 package. the tqp3m 9007 has the b enefit of having high linearity whil e also providing very low noise across a broad range of frequencies . this allows the device to be used in both receive and transmit chains for high performance systems. the amplifier is internally matched using a high performance e - phemt process and only requires an external rf choke and blocking/bypass capacitors for operation from a single +5v supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the tqp3m 9007 covers the 0.1 - 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure . pin # symbol 1 rf i n 3 rf o ut 2, 4 gnd ordering i nfo rmation part no. description tqp3m 9007 high linearity lna gain block tqp3m 9007 - pcb 0.5 - 4 ghz evaluation board standard t/r size = 1000 pieces on a 7 reel . rf in gnd rf out gnd 1 2 3 4
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 2 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature - 5 5 to 150 o c rf input power,cw, 50 ,t= 25o c + 20 dbm device voltage, v dd +7 v operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s v dd 4.75 5 5.25 v tcase - 40 +85 o c tj (for> 10 6 hours mttf ) 190 o c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: +25oc, +5 v supply, 50 ? system. parameter conditions min typical max unit s operational frequency range 1 0 0 4000 mhz test frequency 1900 mhz gain 11.5 13 14.5 db input return loss 18 db output return loss 1 3 db output p1db +23. 6 dbm output ip3 see note 1 . +37 +4 1 db m noise figure 1. 3 db supply voltage, v dd + 5 v current, i dd 125 150 ma thermal resistance (jnc to case) jc 52 o c/w notes : 1. oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz . the suppressio n on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2:1 rule gives relative value w ith respect to fundamental tone.
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 3 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? device characterization data s - p arameter data v dd = +5 v, i cq = 1 25 ma, t = +25 c, unmatched 50 ohm system, calibrated to device leads freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 - 9.21 - 171.69 21.92 165.87 - 28.66 7.52 - 10.26 - 177.68 100 - 9.18 178.66 21.72 164.31 - 28.54 8.08 - 10.62 166.81 200 - 9.58 168. 58 21.39 154.89 - 28.25 11.48 - 10.93 145.14 400 - 11.09 155.91 20.71 134.86 - 27.05 16.59 - 11.61 112.74 800 - 13.55 148.37 18.58 99.19 - 24.58 17.74 - 12.39 63.78 1000 - 14.69 147.37 17.47 84.06 - 23.58 14.87 - 13.43 40.99 1200 - 15.31 148.14 16.33 70.48 - 22.59 12.31 - 13.72 23.70 1500 - 16.32 152.38 14.85 52.18 - 21.45 6.08 - 14.84 - 3.77 1900 - 16.36 155.45 13.11 30.26 - 19.96 - 2.85 - 15.21 - 32.08 2000 - 16.44 154.43 12.73 25.52 - 19.77 - 5.72 - 15.43 - 42.20 2200 - 16.55 154.33 11.98 15.20 - 19.13 - 12.30 - 16.18 - 54.41 2 500 - 16.78 153.75 10.97 0.51 - 18.24 - 20.16 - 16.76 - 84.02 2600 - 16.83 154.69 10.59 - 4.70 - 18.14 - 23.60 - 16.24 - 91.43 3000 - 17.62 157.51 9.53 - 24.26 - 17.17 - 36.43 - 16.21 - 128.42 3500 - 18.79 154.34 8.24 - 48.07 - 16.19 - 53.90 - 14.74 - 165.72 4000 - 20.11 176. 37 7.01 - 72.56 - 15.53 - 72.99 - 11.54 154.74 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 gain (db) frequency (ghz) gain and max stable gain gain (db) de - embedded s - parameter vcc = 5v 0 1.0 1.0 -1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 s11 swp max 6ghz swp min 0.01ghz s(1,1) TQP3M9007 0 1.0 1.0 -1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 s22 swp max 6ghz swp min 0.01ghz s(2,2)
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 4 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit configuration bill of material: tqp3m 9007 - pcb reference desg. value description manufacturer part number q1 high linearity lna gain block triquint tqp3m 9007 c2 100 pf cap, chip, 0603, 50v, npo , 5 % various c6 27 pf cap, chip, 0603, 50v, npo , 5 % various c1 0.1 uf cap, chip, 0603, 16 v, x7r, 10 % various l2 56 nh ind, chip, 0603, 5% various c3 4.7 uf cap, chip, 0603, 6.3 v, x5r, 20 % various b1 0 res, chip, 0603, 1/16w, 5% various l1, d1, c4 do not place various notes: 1. see pc board layout, under application information section, for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 jumper) may be replaced with copper trace in the target application layout. 4. all components are of 0603 size unless stated on the schematic. 5. c6 and l2 value are critical for linearity performance. q 1 l 2 c 6 c 2 c 1 b 1 c 3 j 3 g n d c 2 1 0 0 p f j 1 r f i n p u t c 6 2 7 p f j 2 r f o u t p u t c 1 0 . 1 u f c 3 4 . 7 u f b a c k s i d e p a d d l e g r o u n d l 2 5 6 n h q 1 v d d
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 5 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance tqp3m 9007 - pcb test conditions unless otherwise noted: +25oc, +5v, 1 25 ma, 5 0 system. the data shown below is measured on tqp3m 9007 - pcb notes: 1. oip3 measured with two tones at an output power of + 4 dbm / tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the oip3 us ing 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board and corrected for the board loss of about 0.13 db @ 1.9 ghz . performance plots performance plots data is measured using tqp3m 9007 - pcb. noise figure plot has b een corrected for evaluation board loss of 0.13 db @ 1.9 ghz. frequency mhz 500 900 1900 2100 2600 gain db 20 18 13 12 10 input return loss db 11.5 14 18 17.5 15.5 output return loss db 10.5 13 13 12 10.5 output p1db dbm +22.9 +23. 3 +23. 5 +23.8 +24. 0 oip3 [1] dbm +39.3 +40. 2 +41. 1 +42.2 +42.2 noise figure [2] db 1.4 1.2 1.3 1. 4 1.8 6 8 10 12 14 16 18 20 22 24 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 gain (db) frequency (ghz) gain vs. frequency +85 c +25 c ?40 c vcc = 5v - 25 - 20 - 15 - 10 - 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 input return loss (db) frequency (ghz) input return loss vs. frequency +85 c +25 c ?40 c vcc = 5v - 25 - 20 - 15 - 10 - 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 output return loss (db) frequency (ghz) output return loss vs. frequency +85 c +25 c ?40 c vcc = 5v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.5 1.0 1.5 2.0 2.5 3.0 nf (db) frequency (ghz) noise figure vs. frequency vcc = 5 v +85 c +25 c ?40 c
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 6 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? 30 35 40 45 50 0 2 4 6 8 10 12 oip3 (dbm) output power (dbm) oip3 vs. output power/tone freq. = 900 mhz 1mhz tone spacing vcc = 5v +85 c +25 c ?30 c ?40 c 30 35 40 45 50 0 2 4 6 8 10 12 oip3 (dbm) output power/tone (dbm) oip3 vs. output power/tone freq. = 1900 mhz 1 mhz tone spacing vcc = 5v +85 c +25 c ?30 c ?40 c 30 35 40 45 50 0.5 1.0 1.5 2.0 2.5 oip3 (dbm) frequency (ghz) oip3 vs. frequency 1 mhz tone spacing temp. = 25 o c vcc = 5v 22 23 24 25 - 40 - 20 0 20 40 60 80 p1db (dbm) temperature ( c) p1db vs. temperature 1900 mhz 900 mhz vcc = 5v - 60 - 55 - 50 - 45 - 40 - 35 - 30 10 12 14 16 18 20 aclr1 (dbc) output power (dbm) aclr vs. output power 900 mhz 1900 mhz single carrier 1+64dpch wcdma, par 10.2db @ 0.01% probability vcc = 5v 5 10 15 20 25 30 0 5 10 15 20 output power (dbm) input power (dbm) power compression curve 900 mhz 1900 mhz
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 7 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? pin description pin symbol description 1 rf input input, matched to 50 ohms. external dc block is required. 3 v dd / rfout output, matched to 50 ohms, extern al dc block is required and supply voltage . 2, 4 gnd paddle backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see page 7 for mounting configuration . applications information pc board layout top rf l ayer is .014 nelco n4000 - 13, ? r = 3.9, 4 total layers (0.062 thick) for mechanical rigidity. metal layers are 1 - oz copper. 50 ohm microstrip line details: width = .029, spacing = .035 the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. for further technical inform ation, refer to www.triquint.com rf in gnd rf out gnd 1 2 3 4
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 8 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? mechanical information package information and dimensions this package is lead - free/rohs - compliant. the plating material on the leads is nipdau. it is compatible with both le ad - free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. the compone nt will be marked with a 3m9007 designator with an alphanumeric lot code on the top surface of package. the y represents the last digit of the year the part was manufactured; the xxx is an auto generated number. mounting configuration all dimensions are in millimeters (inches). angles are in degrees. notes : 1. ground / thermal vias are cr itical for the proper performance of this device. vias should use a .35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal therm al performance. 3. rf trace width depends upon the pc board material and construction. 4. use 1 oz. copper minimum. 3m9007 yxxx
tqp3m 9007 ?w high linearity lna gain block data sheet: rev c 05/25 /1 1 - 9 of 9 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital world to the global network ? product compliance information esd information esd rating: class 1a value: passes ? 250 v to < 500 v test: human body model (hbm) standard: jedec standard jesd22 - a114 esd rating: class iv value: passes ? 1000 v test: charged device model (cdm) standard: jedec standard jesd22 - c101 solderability compatible with the latest version of j - std - 020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony fre e ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl 3 at +260 c convection reflow the part is rated moisture sensitivity level 3 at 260c per jedec standard ipc/jedec j - std - 020. contact information for the latest specifications, additiona l product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.c om fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable . triquint makes no warranties regarding the information contain ed herein . triquint assumes no responsibility or liability whatsoever for any of the information contained her ein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely wi th the user. all information contained herein is subject t o change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any part y any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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